Furthermore, the goal of sustainable and energy-efficient production and reduced OPEX is also driving our customers to replace conventional EAF power supply systems based on a thyristor-controlled rectifier with feeding solutions based on advanced IGBT (insulated gate bipolar transistor) power electronics. The grids in existing production sites that use the integrated route are often not powerful enough to cope with a conventional EAF.
The new family of IGBT-based electronics modules, called X-Pact® AURA, boasts a completely modular concept, and the state-of-the-art power electronics technology guarantees maximum efficiency and power density. The new design achieves world-class performance in terms of current stability, dynamic response, efficiency, reliability, redundancy, and minimal impact on electric network quality.
The X-Pact® AURA platform provides a common, modular approach for DC furnace feeding. The chosen topology includes a multi-pulse diode bridge rectifier, a common DC bus, and an IGBT-based chopper stage. The rated power ranges from five to 350 MVA, depending on the power and number of modules. The use of innovative modulation techniques and proprietary control algorithms ensure a maximum power transfer with minimal impact on grid power quality.
Compared to the conventional thyristor-based DC design, X-Pact® AURA offers customers an unprecedented improvement in the key power quality parameters: a power factor above 0.95 and 30% flicker reduction.
The IGBT-based X-Pact® AURA system “cleans” the load of the furnace and enables the installation of a high-power melting unit within a weak grid environment.